Chemical mechanical planarization market seen hitting $15.72B by 2035

The global chemical mechanical planarization market is projected to nearly double by 2035 as semiconductor miniaturization, AI chips and advanced packaging increase demand for precision wafer polishing. The report also points to rising domestic chip investment, new slurry technologies and regional fab buildouts as key growth drivers.

Why it matters: - Chemical mechanical planarization, or CMP, is becoming more central to advanced chipmaking as device geometries shrink and packaging becomes more complex. - The market’s growth tracks directly with semiconductor capacity, advanced packaging, and consumables demand across slurries, pads, conditioners and endpoint detection systems. - CMP is increasingly a yield-critical step for sub-7nm nodes, 3D NAND, chiplets and heterogeneous integration.

What happened: - Market Research Future estimated the global CMP market at USD 7.35 billion in 2025. - The report projects the market to rise from USD 7.93 billion in 2026 to USD 15.72 billion by 2035. - That outlook implies a 7.90% compound annual growth rate during the forecast period. - The report said the market grew from about USD 4.43 billion in 2024 to USD 4.72 billion in 2025. - The report said a sample copy of the report is available online.

The details: - Semiconductor miniaturization below 7nm is driving more precision CMP steps per wafer. - AI-driven high-performance computing and 3D NAND architectures are increasing demand for flatter bonding interfaces. - Global 300mm fab equipment spending is projected to reach USD 107 billion in 2025 and rise further through 2027. - Silicon remains the dominant material segment. - Metal CMP is growing quickly because of copper and cobalt interconnect applications in leading-edge nodes. - The report says AI-driven process tools are shifting CMP toward closed-loop operations with real-time endpoint detection. - Nanomaterial-dispersed slurries using ceria, silica and alumina are becoming standard in advanced logic and memory fabs. - Sustainable CMP formulations are gaining attention as suppliers try to reduce chemical waste, water use and disposal burden. - FUJIFILM Corporation announced in February 2025 about USD 26.75 million in investment to expand its Belgium CMP slurry production facility. - The report also flags dry CMP and non-contact planarization as pre-commercial next-generation techniques. - The report’s segmentation covers equipment, components, technology nodes, substrates, applications and end-use industries. - The substrate list includes silicon, silicon carbide, gallium nitride, III-V compound semiconductors and glass. - The application list includes semiconductor manufacturing, MEMS devices, photovoltaics, optoelectronics and microelectronics. - The end-use list includes logic semiconductor, memory, foundry, IDMs and advanced packaging. - Another full report description is available online.

Between the lines: - The forecast reflects more than simple market expansion. It points to structural dependence on CMP as chipmakers move to smaller nodes and denser 3D architectures. - Domestic semiconductor incentives in the U.S., Europe and China are broadening CMP demand beyond the traditional Asia-Pacific manufacturing base. - Competition is intensifying as vendors race to support sub-3nm nodes, hybrid bonding, fan-out wafer-level packaging and compound semiconductor substrates. - The report’s technology trends suggest CMP is evolving from a mechanical polishing step into a data-driven process platform. - Localization of CMP supply chains could reshape where slurry and pad production is built over the next decade.

What's next: - North America is expected to remain a major demand center, with the report assigning it about 40% of global market share. - The U.S. CMP market was valued at USD 1.79 billion in 2025 and is projected to reach USD 3.09 billion by 2035. - Asia-Pacific is projected to be the fastest-growing region, with an estimated 10.85% CAGR from 2026 to 2035. - Europe should continue to gain from the European Chips Act, local fab investments and supplier expansions in Belgium and Germany. - The report says compound semiconductors and advanced packaging will keep expanding the addressable market beyond traditional silicon applications. - Major players named in the report include Applied Materials, Entegris, DuPont, Fujimi, Hitachi Chemical, Ebara, Lam Research and BASF.

The bottom line: - CMP is shifting from a back-end consumables market to a strategic enabler of next-generation semiconductor manufacturing, and the report expects that shift to drive steady growth through 2035.